BGA design rules

Hello,

I am designing a PCB with high density BGA chips (0.4mm pitch). The recommended pad size is 0.2mm with "VIA IN PAD" option.

1. Do you support "VIA IN PAD" with filled vias?

2. Do you have microvias (laser vias) option?

3. If so, what is the minimal hole size and pad size?

4. What is the thickness of the top layer that supports these laser vias?

Thanks,

Yuval