Ledo 6060 - Photosensitive Resin
Ledo 6060 - Photosensitive Resin
Somos Ledo 6060 is a photo sensitive resin material with tough texture and excellent waterproof performance developed by DSM which can be used to make precision parts for prototyping and functional testing.
Characteristics
Price: From $1.00
Technology: SLA
Build time: 24 - 48 hours
Tolerance: ±0.2mm or within 0.3%
Wall thickness: 0.8mm
Maximum size: 580*580*390mm
Heat deflection temp: 56℃
Characteristics: High dimensional stability, good temperature resistance, small-batch parts.
Weaknesses: NOT suitable for outdoors, high temperatures, sunlight and UV light environments.
Applications: Waterproof models, functional prototypes in automotive, medical, consumer electronics fields.
Material Properties
Measurement | Test Method | Value |
---|---|---|
Heat deflection temperature | ASTM D648 @ 0.46 MPa (66 psi) | 56℃ |
Flexural modulus | ASTM D790M | 2,400MPa |
Impact strength notched Izod | ASTM D256A | 45J/m |
Tensile modulus | ASTM D638M | 2,450MPa |
Tensile strength | ASTM D638M | 50MPa |
Elongation at break | ASTM D638M | 10% |
Last updated on Nov 27,2023