0.5mm pitch BGA - how to setup for manufacturing in KiCad

Hello,

in our application we use 0.5mm pitch BGA package.

I read this article  https://jlcpcb.com/help/article/BGA-Design-Guidelines---PCB-Layout-Recommendations-for-BGA-packages and I dont know if I understand correctly image below, in particular the sentence highlighted.

Does it mean that in inner layers there is no need to have any annular ring size? And because of that it is possible to route it in inner layers when via in pad is used?

We use Kicad version 8 and in this EDA the annular ring is present even in inner layers. Is there any preferred way on how to handle this? I am afraid that if I submit gerber files with annular rings present in inner layers, the manufacturing process will fail.