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Ledo 6060 - Photosensitive Resin

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Ledo 6060 - Photosensitive Resin

Somos Ledo 6060 is a photo sensitive resin material with tough texture and excellent waterproof performance developed by DSM which can be used to make precision parts for prototyping and functional testing.


Price:  From $1.00

Technology:  SLA

Build time: 24 - 48 hours

Tolerance:  ±0.2mm or within 0.3%

Wall thickness:  0.8mm

Maximum size:  580*580*390mm

Heat deflection temp:  56℃

Characteristics:  High dimensional stability, good temperature resistance, small-batch parts.

Weaknesses: NOT suitable for outdoors, high temperatures, sunlight and UV light environments.

Applications:  Waterproof models, functional prototypes in automotive, medical, consumer electronics fields.

Material Properties

MeasurementTest MethodValue
Heat deflection temperatureASTM D648 @ 0.46 MPa (66 psi)56℃
Flexural modulusASTM D790M2,400MPa
Impact strength notched IzodASTM D256A45J/m
Tensile modulusASTM D638M2,450MPa
Tensile strengthASTM D638M50MPa
Elongation at breakASTM D638M10%



Last updated on Nov 27,2023

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