Vias for use under a big module such as ESP32

When using a bigger module like the ESP32 on a two layer board the ground cannot be easily connected directly because the other signals are routed all around the module, and it needs to be brought from the bottom layer by vias.

When using small packages where basically the whole bottom is soldered it is recommended to use copper filled vias for this.

However, the ESP32 has only a small ground pad, and the vias can be placed well away from the soldered area.

Would untented or tented vias also work in this situation?