Via-in-pad Manufacturing Question

Hi, I would like to use JLCPCB's free POFV feature to put vias directly under pads to save space on a high-density 8 layer board. Is the below able to be manufactured? See screenshot as well.

Via hole size: 0.2mm

Via size: 0.3mm

Pad size (not including via annular ring): 0.2mm

Pad pitch: 0.4mm

Via hole spacing: 0.2524mm

Minimum copper-to-copper clearance: 0.15mm

I have read the article here: https://jlcpcb.com/capabilities/Capabilities and have found it very helpful. I am just looking to eliminate any misunderstanding on my part. Thank you for your assistance.