minimum distance between hole of a via to round pad

For my project I'm using a component the T8F81C2 which has which is a 81-FPGA (5 x 5), here they recommend using pad sizes of 0.25mm diameter. each separated by 0.5mm

so far I'm using the the smallest possible via that is available the 0.15mm/(0.25/0.3mm)  for a 6 layer PCB board.

the only rule that i can not find is what the minimum distance is allowed between pad and hole.

Or is there for my case none since that via is gonna be filled?

And is JLCPCB capable of producing a PCB were the T8F81C2 can be put on?