Are 0.35mm pin pitch QFNs supported? Is ENIG required for 0.35mm or 0.4mm QFNs?

Are footprints for 0.35mm pin pitch parts (pad size 0.8x0.2mm with 0.15mm spacing or 0.875x0.15mm with 0.2mm spacing) supported?

The capabilities page says the minimum SMD pad to pad clearance is 0.15mm but also mentions "Minimum SMD pad: 0.25mm × 0.25mm". What is that addition intended to mean? That the 0.15mm spacing only applies to pads > 0.25x0.25mm? Or that regardless of the spacing only pads of at least 0.25mm in either direction are supported?

The BGA rules section mentions that 0.2mm-0.25mm BGA pad diameter requires ENIG (which now incurs additional cost). Does this apply to rectangular pads (with rounded corners) with a size of 0.25x0.25mm, 0.8x0.2mm and/or 0.8x0.25mm as well?