RF PCB Stackup

I am designing an RF PCB using RO4350B and would like to create a hybrid stack-up combining RO4350B with FR-4. Specifically, I want the RO4350B layer only under certain RF sections of the board (e.g., the feed network and antenna region), while the rest of the PCB is backed with FR-4 for mechanical support and for routing non-critical traces.

The RO4350B section does not extend across the full width of the board. Instead, part of the PCB will consist of a region containing RO4350B on its own (for the antenna), and another adjacent region where RO4350B sits on top of FR-4. I will also have some signals that must transition between the RO4350B region and the FR-4-backed region, meaning vias will need to pass between the two materials.

Can you do this and how do i get a quote?